Events Calendar
The Evolution of Photonic Integration Based Products and Related Technologies
Thursday March 31, 2016
| 11:00 am
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Presenter: | Alfredo Viglienzoni, SVP of Business Development and Emerging Markets BU at Skorpios Technologies |
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| Series: | OSE Seminars | |
| Abstract: |
This presentation will provide an overview of products based on photonic integration and the related technologies; it will then focus on Silicon Photonics and its promises. After this introduction, the Skorpios technology platform will be described. Skorpios has developed a proprietary process that monolithically integrates III-V materials into SOI wafers. Butt-coupled III-V and SOI waveguides are co-fabricated in a wafer-scale CMOS process, and they are naturally aligned by CMOS lithography. The metal bonding between III-V chips and the Si substrate serves as an excellent heat-sinking path for III-V devices, which lowers the laser junction temperature and enables uncooled operation at high temperatures. The fabricated Silicon photonic chips including the III-V material are hermetically sealed by SiO2 during the CMOS process, which simplifies the packaging and reduces the cost. High-efficiency III-V EAMs and MZMs can also be integrated using the same process. ll such attributes make Skorpios=92 platform ideal to build solutions that meet the increasing challenges of bandwidth growth in telecom and datacom applications with small footprint, low power consumption, and low cost. About Skorpios Technologies Skorpios is a fabless semiconductor company delivering highly integrated communications products based upon our proprietary, wafer-scale, silicon photonics process. This novel process leverageshe existing silicon manufacturing ecosystem to enable high bandwidth interconnectivity at mature CMOS manufacturing costs. Skorpios' unique platform can be used to address a wide range of applications: high-speed video, data and voice communications for networking, cloud computing, storage and data centers, several other verticals such as health care, sensing, security, aerospace. |
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| Location: | Room 103, Center for High Tech Materials | |
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