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Fabrication of Atom Chips for Cold Atom Systems

Jeffrey DeNatale, Teledyne Scientific

(Session : Thursday from )

Abstract. Devices based on cold- and ultra-cold atoms represent promising technologies for high-precision sensing. A key enabler for the miniaturization of these systems is the “atom chip” which collocates structures allowing creation and manipulation of cold- and ultra-cold atom clusters. Under the DARPA-sponsored gBECi program and in collaboration with University of Colorado, Boulder (UCB), TS&I has been manufacturing a variety of high-performance atom chips for compact cold atom systems. These can integrate multiple functions, including magnetic field generation, through-chip optical access, and vacuum electrical interconnection in a compact footprint. The atom chips leverage many of the process elements from the MEMS and electronics industries, but the unique device requirements can impose significant fabrication and integration challenges associated with vacuum compatibility, materials selection, post-process compatibility, and the need for widely disparate feature geometries. The range of atom chips demonstrated by TS&I will be presented, highlighting the key features enabling compact cold atom system realization and the challenges involved in their fabrication.