High-Density Interconnects for the FVTX

The sensors are eventually placed on a polyamide flex-circuit High-Density-Interconnect (HDI) that acts to provide an interface between the sensors and the read-out chips (FPHX), and provide low- voltage power and clocks to the chips, bias to the sensor and read-out serial lines from the chips. This HDI was developed and designed here at UNM.

More to come...